ZyCube Unveils New CMOS Packaging Technology for Camera Phones
July 27, 2007
According to a Nikkei report, Tokyo-based ZyCube has developed a chip size packaging technology, codenamed ZyCSP, to make more compact CMOS (Complementary Metal-Oxide Semiconductor) image sensors for use in camera phones. Zycube claimed that the ZyCSP technology is able to reduce image sensor chip size to 0.64mm, and the prototype chips were manufactured by Oki, pursuant to the partnership formed by the two companies in January 2007. According to the Nikkei report, Oki will invest one billion Yen (US$ 8.4 million; US$1 = 119.1 Yen) to upgrade its existing chip-packaging line to meet ZyCSP requirements by September. In the initial phase, Oki is projected to produce eight-inch wafers using ZyCSP technology at a monthly capacity of 2,000 to 3,000 units, which is expected to expand to 12,000 units by the second half of 2008.